FMU support of temperature dependent ROM's
- 19037 COMPAS
- New library
To obtain temperature dependent ROM's, components modeled using the finite element method can be trained using ML technology and, following the FMI 3.0 standard, packaged as an FMU. This FMU, which hides the IP of the component manufacturer, can be seen as a smart super-element and can be used in a combined residual-ROM simulation.
- Adrie Bout, MSC Software Benelux B.V.
- Research area(s)
- Basically all areas with structural FEM applications (electronics, automotive, etc.)
- Technical features
An easy to use method for sharing component properties (dimensions, stiffness behavior, etc.) along the supply chain, while hiding IP.
- Integration constraints
The integration follows the FMI 3.0 standard. The required FMU data is described in an xml file, which contents have been discussed and agreed upon by the COMPAS partners. Windows and Linux are the supported platforms.
- Targeted customer(s)
Companies and research institutes in various market segments, like electronics, automotive, aerospace, etc.
- Conditions for reuse
An FMU created by software from MSC Software requires an MSC license to be consumed in a combined residual-ROM model.
- Publication date
- Involved partners
- NXP Semiconductors (NLD)
- Fraunhofer ENAS (DEU)
- MicroConsult Engineering GmbH (DEU)
- Infineon Technologies AG (DEU)