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ITEA is the Eureka Cluster on software innovation
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Standardized exchange format for thermo-mechanical reduced-order models

19037 COMPAS
New standard

A standardized vendor-independent exchange format for thermo-mechanical reduced-order models is defined, which allows for re-integration into 3D simulation environments. The compact nature of the models allows to protect intellectual property (IP) because internal details of the modelled component are obfuscated. Once the format is accepted by a standardization organization, it will enable for the first time IP-safe exchange of thermo-mechanical compact models along the supply chain, e.g. of in the microelectronics industry, allowing for easier and better designs w.r.t mechanical reliability.

Martin Niessner (Infineon Technologies AG)
Research area(s)
Thermo-mechanical reliability simulation
Technical features

(T1) The exchange format is independent of the vendor and uses recently released version 3.0 of the well-known FMI standard (T2) By using the new features of the recently released FMI 3.0, such as the extension from variables to arrays, the matrices of complex reduced order models can be provided (T3) In contrast to other compact modeling approaches, the reduced-order models described here, can have multiple input/output nodes, contain 3D information and can be re-integrated into 3D simulation environments

Integration constraints

With COMPAS project partner MSC Software, the first 3D FEM simulation environment vendor integrated the new exchange format for export and import in his software. However, other 3D FEM simulation vendors have not yet integrated the new exchange format and need to be convinced and follow. Getting the exchange format accepted by a standardization organization will help to convince other vendors.

Targeted customer(s)

Tiers along the supply chain of the microelectronics industry, e.g. Tier2 companies such as NXP and Infineon provide thermo-mechanical reduced order models using the new format to their Tier1 companies, e.g. automotive integrators such as Robert Bosch, Continental, Vitesco, Aptiv, Veoneer

Conditions for reuse

Once the new exchange format is accepted by a standardization organization, interested parties need to obtain the definition document from the standardization organization. Once the new format is integrated in software packages of different vendors, the new format can be used companies along the supply chain and, thus, generate value-add for those companies.

Publication date
Involved partners
NXP Semiconductors (NLD)
MicroConsult Engineering GmbH (DEU)
Infineon Technologies AG (DEU)
Jade University of Applied Sciences (DEU)
MSC Software Benelux (NLD)